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Pressure
Freescale Semiconductor
+
MPX4080D Rev 4, 1/2009
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
MPX4080D Series
0 to 80 kPa (0 to 11.6 psi) 0.6 to 4.9 V Output
The MPX4080D series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
Features
* * * * 3.0% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40 to 105C Easy-to-Use, Durable Epoxy Unibody Package
ORDERING INFORMATION
Device Name MPX4080D Package Options Tray Case No. 867 None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPX4080D
* UNIBODY PACKAGE
*
MPX4080D CASE 867-08
(c) Freescale Semiconductor, Inc., 2005, 2008, 2009. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic Pressure Range Supply Voltage Supply Current Minimum Pressure Offset(3)(0 to 85C) @ VS = 5.1 V Full Scale Output(4)(0 to 85C) @ VS = 5.1 V Full Scale Span(5)(0 to 85C) @ VS = 5.1 V Accuracy Sensitivity 1. 1 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.
(1)
Symbol POP VS Io Voff VFSO VFSS -- V/P
Min 0 4.85 -- 0.478 4.772 -- -- --
Typ -- 5.1 7.0 0.575 4.900 4.325 -- 54
Max 80 5.35 10 0.672 5.020 -- 3.0 --
Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa
(2)
MPX4080D 2 Sensors Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings (1)
Rating Maximum Pressure Operating Temperature Storage Temperature (P1 > P2) Symbol Pmax TA Tstg Value 400 -40 to +105 -40 to +125 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 3
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout 1
Pins 4, 5, and 6 Are NO CONNECTS GND 2
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX4080D Sensors Freescale Semiconductor 3
Pressure
On-Chip Temperature Compensation and Calibration
Figure 2 shows the sensor output signal relative to differential pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates the differential sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.
5 4.5 4 3.5 Output (V) 3 2.5 2 1.5 1 0.5 kPa PSI 0 0 10 20 30 40 50 60 70 80 MIN MAX VS = 5.1 Vdc TA = 25C MPX4080
The MPX4080D pressure sensor operating characteristics, internal reliability, and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Span Range (TYP) Stainless Steel Metal Cover Die Bond Vout OUTPUT IPS GND 470 pF
TYP
Pressure (kPa)
Offset (TYP)
Figure 2. Output versus Pressure Differential
Fluoro Silicone Gel Die Coat Wire Bond
Die
Epoxy Plastic Case
Lead Frame
Differential/Gauge Element
Figure 3. Cross-Sectional Diagrams (not to scale)
+5.0 V
Vs
1.0 F
0.01 F
Figure 4. Recommended Power Supply Decoupling and Output Filter (For additional output filtering information, refer to Application Note AN1646.)
MPX4080D 4 Sensors Freescale Semiconductor
Output Range (TYP)
Pressure
Transfer Function (MPX4080D) Nominal Transfer Value:
Vout = VS (P x 0.01059 + 0.11280) (Pressure Error x Temp. Mult. x 0.01059 x VS) VS = 5.1 V 0.25 VDC
Temperature Error Multiplier MPX4080D
4.0 3.0 2.0 1.0 0.0 -40 -20 0 20
Temp. - 40 0 to 85 +105
Multiplier 3 1 2
40
60
80
100
120
130
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 105C.
Pressure Error Band
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 0
Error Limits for Pressure
20
40
60
80
100
120
Pressure in kPa
MPX4080D
Pressure 0 to 6 kPa 0 to 60 kPa 60 to 80 kPa Error (max) 1.8 kPa 1.5 kPa 2.3 kPa
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side is identified by the stainless steel cap.
MPX4080D Sensors Freescale Semiconductor 5
Pressure
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N BASIC ELEMENT
MPX4080D 6 Sensors Freescale Semiconductor
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MPX4080D Rev. 4 1/2009

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